Engineering Services & Development Capabilities
At Cornet Technology India, we don’t just manufacture rugged boards—we engineer solutions. From concept design to long-term support, we provide end-to-end services tailored to the defense, aerospace, and mission-critical sectors. Whether it’s customizing a COTS board, integrating firmware into your system, or building a full ATR system for your platform—we’ve got it covered.
Our Engineering Approach
Empowering Customized COTS Embedded Solutions for Mission-Critical Applications
Cornet Technology India designs, develops, and supports high-performance embedded computing systems tailored for defense, aerospace, and industrial use cases. With decades of experience and a proven track record in the Indian defense ecosystem, we deliver customizable, ruggedized solutions that meet demanding operational requirements and accelerate deployment timelines.
Our engineering excellence spans the full product lifecycle—from requirement analysis to obsolescence management – under one roof. Every product is developed and tested in India, in line with the “Make in India” initiative and with support for global OEMs looking to localize.
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Requirement Analysis :
Collaborative understanding of customer needs across defense, aerospace, and critical infrastructure sectors
We engage closely with DRDOs, DPSUs, and private system integrators to define precise operational and environmental requirements. - Architecture Proposal :
From Commercial Off-The-Shelf to Modified COTS (MCOTS) and fully custom solutions
Based on user needs, we offer scalable configurations -whether from existing SBCs, VPX/VME/PMC modules, or entirely new system-level designs. - Hardware and Software Design :In-house expertise in embedded board design, FPGA development, and BSP/driver engineering
Our cross-functional teams work in sync to deliver designs with optimized thermal, signal integrity, and power management profiles – using industry best practices. - Modular Building Blocks :Comprehensive product portfolio: SBCs, mission computers, ATRs, network switches, I/O cards, DAQ systems, and display consoles
With support for Intel/AMD/Xilinx architectures, we enable flexible configuration of subsystems across platforms.
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Prototyping and Qualification :
Accelerated prototyping and MIL-STD environmental qualification support
We provide early hardware access, design validation testing, and support for platform integration—reducing time-to-deployment for integrators. -
Customer Support :
Dedicated engineering and field teams ensure seamless integration and deployment
From schematic reviews to firmware updates, our responsive support model empowers success in lab and field environments. -
Lifecycle & obsolescence management :
Long-term availability planning and obsolescence support tailored to defense timelines
We track component supply chains, provide alternates, and support mid-life upgrades, ensuring readiness across long project cycles.
Resources to manufacture quality state-of-the-art COTS and custom products
- Sourcing Excellence
All components and PCBs are sourced from vetted, approved vendors in alignment with detailed Bill of Materials (BoM), ensuring quality, traceability, and long-term availability. - High-Reliability Assembly
Our embedded boards are assembled following robust internal procedures aligned with IPC-A-610 Class 3 workmanship standards, suited for mission-critical and defense-grade electronics. - Inline Process Control
Each stage of the manufacturing lifecycle is subject to rigorous inspection, including automated optical checks and manual quality gates to maintain production consistency. - Functional Validation
Every board undergoes thorough functional testing using validated test jigs and procedures tailored to customer requirements and product configurations. - Environmental Screening & Final Integration
Upon conformal coating and mechanical assembly, boards may be subjected to environmental stress screening (ESS) such as thermal cycling and vibration tests as per MIL standards and project-grade specifications – available on request.
Engineering Services
Concept to Qualification — Embedded, Rugged, and Mission‑Ready
Product Design & System Engineering
- Product design specifications
- System architecture & trade studies
- Prototyping & design reviews
Embedded Software & Firmware
- Board support packages (BSP)
- Real‑time OS, device drivers, middleware
- Firmware bring‑up & diagnostics
- Audio/Video pipelines
Board & Hardware Design
- High‑speed digital & mixed‑signal
- RF & antenna design
- Power supply design
- Hardware board design services
Industrial & Ruggedized Designs
- Thermal, shock & vibration considerations
- Environmental & EMI/EMC engineering
- Ruggedization for defense/avionics
FPGA & DSP / RADAR
- FPGA design & verification
- Signal & image processing
- RADAR/sonar algorithm integration
Verification, Validation & Certification
- DO‑178C / DO‑254 / DO‑160 support
- FCC/CE/IEC compliance & testing
- Test plans, procedures & traceability
Production & Lifecycle Support
- PCB design & library management
- Production support & NPI
- Obsolescence & lifecycle management
FPGA Design, Integration & IP Core Support
Cornet India provides robust FPGA design and integration services tailored for mission-critical Defense and Aerospace systems. Our expertise spans across:
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Board bring-up and validation for FPGA-based SBCs & subsystems
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Custom firmware development and HDL integration for VPX, VME, and COTS platforms
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System-level FPGA customization based on program-specific I/O, timing, and interface needs
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Delivery and support of essential IP cores including high-speed serial protocols, data interfaces, and control logic
Our engineering team ensures tight integration between FPGA, CPU, and peripheral subsystems — delivering optimized, ruggedized solutions that meet stringent performance and reliability standards
FPGA Design
Our Resources
To comply with the most stringent requirements of today’s HPEC market, Cornet India has developed expertise in thermomechanical simulation and signal integrity simulation/analysis. With this know-how, Cornet India has the capacity to develop and test extremely complex & very high-density boards and systems:
Development Software:
- PCB Altium Designer
- Cadence
Measuring equipment and instruments:
- High-Performance Oscilloscopes
- Digital and analog signal analysers
- Spirent Test Center
- 45 GHz vector network analyzer (VNA)
- High-performance signal generators
Simulation Capabilities
- Cornet India provides advanced simulation support including thermal, power integrity, and signal integrity analysis at the board level, and thermal and structural analysis at the subsystem level.
- These simulations ensure optimal performance, reliability, and compliance with defense and aerospace standards.
Cornet India supplies a full set of development tools and highly responsive technical support, to build successful solutions:
Our Grades
(*) Temperature grade options depend on semiconductor availability. Please contact us for compatibility and lead times.
| Standard | Extended | Rugged | Conduction-cooled 71°C | Conduction-cooled 85°C | |
| Coating | Optional | Yes | Yes | Yes | Yes |
| Operat. Temp. | 0 to 55°C | -20 to 65°C | -40°C to 71°C (*) | -40°C to 71°C at the thermal interface (*) | -40°C to 85°C at the thermal interface (*) |
| Rec. airflow | 1 .. 2 m/s | 2 .. 3 m/s | 2 .. 5 m/s | – | – |
| Oper. HR% no cond. | 5 to 90% | 5 to 95% | 5 to 95% | 5 to 95% | 5 to 95% |
| Storage Temp. | -45°C to 85°C | -45°C to 85°C | -45°C to 100°C | -45°C to 100°C | -45°C to 100°C |
| Sinusoidal Vibr | 2G [20..2000]Hz | 2G [20..2000]Hz | 5G [20..2000]Hz | 5G [20..2000]Hz | 5G [20..2000]Hz |
| Random Vibr | 0.002g2 /Hz [10..2000]Hz | 0.002g2 /Hz [10..2000]Hz | 0.05g2 /Hz [10..2000]Hz | 0.1g2 /Hz [10..2000]Hz | 0.1g2 /Hz [10..2000]Hz |
| Shock 1/2 Sin. 11ms | 20G | 20G | 40G | 40G | 40G |