Embedded Processor Boards (SBCs)

Key Features

  • SOSA™-aligned 3U VPX board (1” pitch)
  • USB4.0 (40 Gb/s), USB 3.2, USB 2.0 interfaces
  • M.2 NVMe SSD support with write-protect option
  • 8-core AMD Ryzen V3000 processor
  • Up to 64 GB soldered DDR5 ECC memory

Key Features

  • 8-core Intel® Xeon® W-11000E Series
  • Up to 64 GB DDR4 ECC memory (soldered)
  • Dual 10 Gigabit Ethernet (10GBASE-KR)
  • Conduction-cooled and air-cooled
  • XMC expansion site (PCIe Gen4 x8)

Key Features

  • Quad-core Intel® CoreTM i7-1185GRE
  • Up to 16 GB LPDDR4X memory
  • 10 Gigabit Ethernet and Gigabit Ethernet ports
  • PCIe Gen3 fabric interfaces
  • Supports multiple operating systems/BSPs

Key Features

  • 6 × Analog Devices SHARC DSPs
  • 4 GB SDRAM pool accessible by DSPs
  • VME64x bus with high-speed block transfers
  • FPGA-based memory and I/O controller
  • Two PMC/XMC sites for custom I/O modules

Key Features

  • 11th Gen Intel® Xeon® W-11865MRE processor
  • Up to 64 GB DDR4 ECC memory (dual-channel)
  • Four 2.5GBASE-T Ethernet ports
  • Multiple PCIe Gen3/4 interfaces
  • XMC expansion site (PCIe Gen4 x8)

Key Features

  • Intel® Xeon® D-1500 family server-grade SoC
  • Up to 32 GB DDR4 ECC memory
  • Multiple 10 Gigabit and Gigabit Ethernet interfaces
  • XMC/PMC mezzanine site for I/O expansion
  • Supports multiple operating systems/BSPs

Key Features

  • 11th Gen Intel® CoreTM i7-1185GRE processor
  • Up to 16 GB DDR4 ECC memory
  • PCIe Gen3 backplane interfaces
  • XMC expansion site for additional I/O
  • Air-cooled and conduction-cooled

Key Features

  • 6th Gen Intel® CoreTM i7 quad-core processor
  • Up to 16 GB DDR4 memory with ECC support
  • Gigabit Ethernet interfaces for control and data
  • High-speed PCIe links on the VPX backplane
  • Optional XMC/PMC mezzanine site

Key Features

  • 6th Gen Intel® CoreTM i7 quad-core processor
  • Up to 16 GB DDR4 SDRAM with ECC
  • Dual Gigabit Ethernet ports (VME P2 connectors)
  • PCI-X and VME64x interfaces
  • On-board XMC site for I/O or graphics expansion

Key Features

  • 6 GB DDR3L ECC SDRAM main memory
  • Onboard Xilinx Kintex-7 FPGA
  • Multi-plane fabric connectivity (PCIe, SRIO)
  • Dual 10G Ethernet and triple Gigabit Ethernet
  • Custom Rear Transition Module (RTM) support

Key Features

  • Four TI TMS320C6678 DSP chips (8 cores each)
  • 1 GB DDR3 memory per DSP (4 GB total)
  • RapidIO and PCIe interconnects linking DSPs
  • Onboard NAND Flash for data and boot storage
  • Supports TI SYS/BIOS DSP OS and Linux

Key Features

  • Five TI TMS320C6678 DSPs (8 cores each)
  • VITA 65.0 SLT3-SWH-4F1U7U1J-14.8.7-n
  • Up to 38 * 1/10/40 GbE on VITA 46 & 66.5 connectors
  • 1GBASE-KX, 10GBASE-KX4/KR, 40GBASE-KR4 (rear)
  • Aligned with the SOSATM Technical Standard