Engineered for Reliability. Built for Mission-Critical Applications.
At Cornet Technology India, we are committed to delivering Rugged, Mission-Critical, and Embedded Computing Solutions tailored for Aerospace, Defense, and Industrial markets.
Key Features
- Up to 96 GB DDR5 5600 RAM, ECC/non-ECC options
- Up to 3× NVMe PCIe Gen4 x4 high-speed storage
- Up to 4× 2.5GbE LAN ports (Intel I226)
- Wide input voltage support: 12V to 60V DC
- 10-year guaranteed product availability
Key Features
- V3C18I or V3C48 processor – 8 cores / 16 threads
- Up to 128 GB SATA SSD onboard storage
- Rugged build qualified to MIL-STD-810G / DO-160G
- Multiple expansion interfaces: 2× mPCIe, UART, I2C
- Infineon TPM 2.0 security (optional)
Key Features
- Dual Intel® CoreTM i7-1185GRE SBCs
- 16 GB DDR4-4267 ECC memory per SBC
- 6-slot 3U VPX backplane
- Operating temp -40 °C to +71 °C
- 64 GB onboard SATA SSD per SBC
Key Features
- Intel Xeon W-11865MRE (8C/16T, up to 4.7 GHz)
- 64 GB DDR4 ECC RAM
- Removable cassette with 8× NVMe SSDs
- Onboard RTC with Li-ion battery
- Dedicated DDR Management Software
Key Features
- 1 ATR full-size chassis (ARINC 404A full ATR)
- High-slot-count OpenVPX backplane
- Integrated managed Gigabit/10Gb Ethernet switch
- MIL-38999 connectors for all external interfaces
- Removable high-capacity SSD storage canisters
Key Features
- Dual 19″ or 21.5″ high-brightness LCD displays
- Picture-in-Picture or Quad View support
- Customizable KVM or video switching interfaces
- 1 × Mic In, 1 × Headphone Out, integrated speakers
- Vehicle/console rack mount with adjustable tilt;
Key Features
- 6 GB DDR3L ECC SDRAM main memory
- Onboard Xilinx Kintex-7 FPGA
- Multi-plane fabric connectivity (PCIe, SRIO)
- Dual 10G Ethernet and triple Gigabit Ethernet
- Custom Rear Transition Module (RTM) support
Key Features
- 5-slot hybrid (3 × 6U VPX slots, 2 × 6U VME64x slots)
- Multi-output power supply (AC input)
- Front-panel access for both VPX and VME module I/O
- Combined forced-air cooling
- Bench-top station with card guides
Key Features
- 4-slot 3U OpenVPX backplane
- Vertical orientation desktop chassis with card guides
- Integrated VPX power supply unit
- Over-temperature protection and fan monitoring
- Table-top mounting, with optional rack-mount kit
Key Features
- 5-slot 6U OpenVPX backplane for module integration
- Vertical desktop/rack-mountable chassis
- Table-top usage with option to mount in 19′′ rack
- Integrated high-wattage VPX power supply
- Easy access to module front panels
Key Features
- Low-power ARM Cortex-A5 processor
- Integrated multi-sensor interface
- 1 GB DDR3 SDRAM and 8 GB eMMC Flash
- Built-in GPS receiver and real-time clock
- Wireless communication support
Key Features
- Intel multi-core processor-based system controller
- 8 GB DDR4 memory
- Dual Gigabit Ethernet ports
- Optional CAN-bus or serial links
- Solid-state drive for OS and data (256 GB SSD)
Key Features
- Hardware H.264/H.265 video encoding
- Supports dual HD video inputs
- Real-time network streaming over Gigabit Ethernet
- Onboard removable SSD storage
- Supports network protocols (RTSP, MPEG-TS)
Key Features
- Onboard 512 GB SSD for recording video locally
- Stream over 1 GbE or 10GbE Ethernet
- air-cooled and conduction-cooled variants
- STANAG 4609 compliant metadata insertion
- Supports multiple operating systems
Key Features
- SOSA™-aligned 3U VPX board (1” pitch)
- USB4.0 (40 Gb/s), USB 3.2, USB 2.0 interfaces
- M.2 NVMe SSD support with write-protect option
- 8-core AMD Ryzen V3000 processor
- Up to 64 GB soldered DDR5 ECC memory
Key Features
- 8-core Intel® Xeon® W-11000E Series
- Up to 64 GB DDR4 ECC memory (soldered)
- Dual 10 Gigabit Ethernet (10GBASE-KR)
- Conduction-cooled and air-cooled
- XMC expansion site (PCIe Gen4 x8)
Key Features
- Quad-core Intel® CoreTM i7-1185GRE
- Up to 16 GB LPDDR4X memory
- 10 Gigabit Ethernet and Gigabit Ethernet ports
- PCIe Gen3 fabric interfaces
- Supports multiple operating systems/BSPs
Key Features
- 6 × Analog Devices SHARC DSPs
- 4 GB SDRAM pool accessible by DSPs
- VME64x bus with high-speed block transfers
- FPGA-based memory and I/O controller
- Two PMC/XMC sites for custom I/O modules
Key Features
- 11th Gen Intel® Xeon® W-11865MRE processor
- Up to 64 GB DDR4 ECC memory (dual-channel)
- Four 2.5GBASE-T Ethernet ports
- Multiple PCIe Gen3/4 interfaces
- XMC expansion site (PCIe Gen4 x8)
Key Features
- Intel® Xeon® D-1500 family server-grade SoC
- Up to 32 GB DDR4 ECC memory
- Multiple 10 Gigabit and Gigabit Ethernet interfaces
- XMC/PMC mezzanine site for I/O expansion
- Supports multiple operating systems/BSPs
Key Features
- 11th Gen Intel® CoreTM i7-1185GRE processor
- Up to 16 GB DDR4 ECC memory
- PCIe Gen3 backplane interfaces
- XMC expansion site for additional I/O
- Air-cooled and conduction-cooled
Key Features
- 6th Gen Intel® CoreTM i7 quad-core processor
- Up to 16 GB DDR4 memory with ECC support
- Gigabit Ethernet interfaces for control and data
- High-speed PCIe links on the VPX backplane
- Optional XMC/PMC mezzanine site
Key Features
- 6th Gen Intel® CoreTM i7 quad-core processor
- Up to 16 GB DDR4 SDRAM with ECC
- Dual Gigabit Ethernet ports (VME P2 connectors)
- PCI-X and VME64x interfaces
- On-board XMC site for I/O or graphics expansion
Key Features
- 6 GB DDR3L ECC SDRAM main memory
- Onboard Xilinx Kintex-7 FPGA
- Multi-plane fabric connectivity (PCIe, SRIO)
- Dual 10G Ethernet and triple Gigabit Ethernet
- Custom Rear Transition Module (RTM) support
Key Features
- Five TI TMS320C6678 DSPs (8 cores each)
- VITA 65.0 SLT3-SWH-4F1U7U1J-14.8.7-n
- Up to 38 * 1/10/40 GbE on VITA 46 & 66.5 connectors
- 1GBASE-KX, 10GBASE-KX4/KR, 40GBASE-KR4 (rear)
- Aligned with the SOSATM Technical Standard
Key Features
- Four TI TMS320C6678 DSP chips (8 cores each)
- 1 GB DDR3 memory per DSP (4 GB total)
- RapidIO and PCIe interconnects linking DSPs
- Onboard NAND Flash for data and boot storage
- Supports TI SYS/BIOS DSP OS and Linux
Key Features
- ARM Cortex-A5 processor-based MCU up to 500 MHz
- Onboard 1 GB DDR2 SDRAM and 8 GB eMMC Flash
- Rich I/O: SPI, I2C, UARTs, and GPIO
- Ethernet interface for real-time data streaming
- Supports multiple operating systems/BSPs
Key Features
- PMC card with ARINC 429 bus controller/receiver
- 4 ARINC-429 receive channels & 2 transmit channels
- Front-panel I/O or rear Pn4 routing
- PCI interface to host (32-bit, 33/66 MHz)
- Driver support for VxWorks, Linux
Key Features
- Dual redundant MIL-STD-1553B bus interfaces
- Front-panel twinax connectors or rear I/O
- Additional serial communication controllers
- Transformer-coupled 1553 transceivers
- Conduction-cooled option with conformal coating
Key Features
- Uses high-performance Ethernet controllers
- Front-panel RJ45 or rugged circular connectors
- 10/100/1000 Mbps operation with auto-negotiation
- Drivers available for Linux, VxWorks, Windows
- Onboard Ethernet MAC/PHY per port
Key Features
- PMC (PCI Mezzanine Card) format module
- Provides multi-protocol serial interfaces
- General-purpose digital I/O lines (TTL/LVDS)
- High-density front-panel connector or rear I/O via P4
- Supports driver software for VxWorks, Linux
Key Features
- Up to 2 GB GDDR5 video memory
- PCI-X or PCIe (via PMC-to-XMC bridge) interface
- Hardware video encode/decode support
- Driver support for real-time OS and Linux
- – Dual-head graphics output